The thermally conductive silicone adhesives market refers to the production and distribution of thermally conductive silicone adhesives. The thermal conductivity of a typical unfilled epoxy system is as low as 0.14 W/ (m. K). This thermal conductivity is increased by adding metallic or ceramic fillers to the adhesive formulation. This helps in the synthesis of thin bond lines that contribute to a lower thermal resistance and provides excellent, reliable adhesion. Widespread applications in energy and industrialization, household appliances, and consumer electronics are driving the growth of the market.
Increasing competition, market saturation, and regional disparities with respect to the availability of raw materials are limiting growth in the market. Increased research and development funding due to expected continued growth in the consumer electronics segment, along with innovations in 5G networking, and the Internet of Things is expected to propel growth in the market in the coming years.
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