April, 2025
According to forecasts by the semiconductor industry Association (SIA), Generative AI chips and automotive applications are expected to drive growth in the market in 2025. The global semiconductor market has experienced its highest-ever sales year in 2024 as semiconductors enable virtually all modern technologies – including medical devices, communications, defense applications, AI, and advanced transportation.
Asia-Pacific IC design product lines are rich and diversified, with applications all over the world, including Smartphone AP, TV SoC, OLED DDIC, LCD TDDI, WiFi, PMIC, MCU, ASIC, and other essential chips.
Geopolitical shifts are reshaping the global packaging and testing industry, with China expanding its mature-node OSAT ecosystem while Taiwan dominates advanced packaging for AI chips, driving 9% sector growth in 2025. Advanced packaging technologies like Fan-Out Panel-Level Packaging (FOPLP) and Chip-on-Wafer-on-Substrate (CoWoS) are experiencing explosive growth, with TSMC's CoWoS capacity doubling to 660K wafers in 2025 (470% surge in CoWoS-L) to meet AI/HPC demand, while FOPLP eyes future AI chip applications after maturing in analog chips. Though supply chain and geopolitical challenges persist, the semiconductor industry is poised for strong growth driven by AI and automotive demand.
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